NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory

POC test chips validate manufacturability using mature 3D NAND-based processes and meet key DRAM performance benchmarks SAN JOSE, Calif., April 23, 2026 /PRNewswire/ -- NEO Semiconductor, a leading innovator in advanced AI and memory technologies, today announced successful...